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Target Recruitment Areas 2010
| DMC RnD Center |
Long-Term Evolution (LTE) Chipset (4G Chips) Development for Mobile Telecommunication Networks; UMTS, 3GPP, All-IP Network [AIPN], GPRS, WiMAX, Frequency Division Duplexing [FDD], Time Division Duplexing [TDD], CDMA2000, cdmaOne, Multicast Broadcast Single Frequency Network Mobile TV, DVB-H-based TV, MU-MIMO, System Architecture Simplification, System Architecture Evolution (SAE), E-UTRAN, OFDMA, Downlink: Physical Downlink Shared Channel (PDSCH), Uplink: Single-Career Frequency Division Multiple Access (SC FDMA), Physical Uplink Shared Channel (PUSCH), Physical Random Access Channel (PRACH), Modulation formats: QPSK, 16QAM, and 64QAM; Spatial Division Multiple Access (SDMA), HDTV Streaming, HDTV Games, HSDPA, HSUPA, VoIP
Next-Generation Chip Development (LTE Network, LTE Chipset, Radio Access Network, SAE Core, Evolved Packet Core [EPC], Mobility Management Entity [MME], Serving Gateway [SGW], PDN Gate [PGW])
- Modem Protocol SW
- RF Circuit Design
Web Base Next-Generation SW Platform Development
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| Media Solution Center |
Global Launching of Mobile Contents Service
- Android, Java, Server Solution, Widget, SNS Developer (SW) |
| Visual Display |
Optical Engineering |
| Digital Appliance |
Sales and Marketing: Korean language graduates |
| Mobile Communication |
Smart Phone Development
- Multimedia, 3D Graphic, Java, Linux SW Engineering |
| Network Solutions |
High-Efficiency RF AMP Development
- High-Efficiency Power Amplifier Design
- High-Efficiency Power Amplifier Module Development Amplifier Development
- Doherty Amplifier, ET Amplifier (E Class Amplifier), Digital Pre-Distortion (DPD) Algorithm Development, Adaptive Baseband Digital Pre-distortion (DPD) Radio-Frequency (RF) Power Amplification (PA) System, System Linearity Improvement
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| Memory |
- Flash Solution Software, Controller |
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System LSI
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- HW Application
- Analog Circuit Design |
| RnD Center |
- Advanced Logic Device / Fabrication
- Flash Device
- TCAD Core Simulator, Material Modeling
- Optical Proximity Correction (OPC): Photolithography, Diffraction, Interference, Resolution Enhancement Technology [RET], Photomask Fabrication, Electron Beam Lithography, Plasma Etching, Electronic Design Automation [EDA] Semiconductor Fabrication Tools, Applied Math and Physics
- Statistics, CMOS Image Sensor Device / Fabrication
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LCD
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- Next LCD (3D, TSP, Fabrication)
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Etc.
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- Storage: HDD Micro-Metrology, Head Gimbal Assembly (HGA) Inspection Platform
- Marketing |
| TRIZ |
TRIZ, Material Science, Device Expertise |
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New Materials
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- Fab Laser Source, Plasma
- Optical Design, Optical Assembly, Electronic Printing |
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